James Jian-Qiang Lu, IEEE Fellow, 3D IC; 3D TSV Integration and Packaging

James Jian-Qiang Lü

Associate Professor

Department of Electrical, Computer, and Systems Engineering (ECSE);

Center for Integrated Electronics (CIE);

NSF Smart Lighting Engineering Research Center (ERC);

Focus Center - New York, Rensselaer: Interconnections for Hyper-Integration (FC-NY);
Center for Future Energy Systems (CFES);
New York State Center for Automation Technologies and Systems (CATS)

Rensselaer Polytechnic Institute (RPI)

James J.-Q. Lu

Associate Professor

Depts.: ECSE, CIE, FC-NY, CFES, CATS, Smart Lighting ERC

Ph.D. (Dr.rer.nat.): Technical University of Munich, Germany, December 1995

Fellow: Institute of Electrical and Electronics Engineer (IEEE)

Fellow and Life Member: International Microelectronics and Packaging Society (IMAPS)

William D. Ashman Achievement Award, James Lu, 3D IC

Career Highlights:

Dr. James Lu is currently an associate professor in ECSE. He is a faculty member of the Center for Integrated Electronics (CIE); NSF Smart Lighting Engineering Research Center (ERC); Focus Center – New York (FC-NY), Rensselaer: Interconnections for Hyper-Integration; the New York State Center for Automation Technologies and Systems (CATS); and Center for Future Energy Systems (CFES). Prior to his positions at Rensselaer, Lu worked as a research associate at the University of Virginia (UVA) in Charlottesville, VA. for a year. While a research scientist at the Technical University of Munich (TU-Munich), he was a Siemens Scholar for three years and a scholar of the German Academic Exchange Program (Deutscher Akademischer Austausch Dienst, or DAAD) for two years.

Dr. Lu authored and co-authored >200 publications in journals, conferences or books. He served as conference, workshop and session chair and committee members of international conferences (such as Technical Chair of IMAPS International Conference on Device Packaging). He has been a panelist, panel moderator, keynote or invited speaker for many conferences, and given many seminars at government labs, universities and industrial organizations. He has served as a reviewer for a number of journals, such as the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Electron Devices; IEEE Electron Device Letters; Applied Physics Letters; Electronics Letters; IEEE Transactions on Semiconductor Manufacturing; IEEE Journal of Solid-State Circuits; Journal of Applied Physics; Solid-State Electronics, J. of Vacuum Science & Technology, etc. He is listed in the special Millennium Edition of Marquis Who's Who in Science and Engineering, received many honorable awards, including the “School of Engineering Research Excellence Award”, Rensselaer, Troy, NY, 2005, the 2008 IEEE CPMT Exceptional Technical Achievement Award "for his pioneering contributions to and leadership in 3D integration/packaging”, the IMAPS 2010 William D. Ashman Achievement Award "for contributions and research in 3D integration and packaging; for leadership contributions at international symposiums and device packaging conferences, and 3-D packaging workshops," and “ School of Engineering Faculty Award: Outstanding Research Team”, Rensselaer, Troy, NY, 2011.

Dr. Lu is a Fellow of IEEE and is involved in the organization’s Electron Devices Society (EDS) and its Components, Packaging, and Manufacturing Technology Society (CPMTS), and a Fellow and Life member of International Microelectronics and Packaging Society (IMAPS). He also is a member of the American Physical Society (APS), Materials Research Society (MRS), Electrochemical Society (ECS) and the International Society of Electrochemistry (ISE), National Technical Committee (3D Chair) for International Microelectronics and Packaging Society (IMAPS).

Research Group News :

"3D ICs" is listed as EE Times' 20 hot technologies for 2012. Note: the photo used in the article is the same as shown below in this page. http://www.eetimes.com/electronics-news/4231126/EE-Times--20-hot-technologies-for-2012?pageNumber=19
Dr. Nicholas LiCausi (graduated spring 2011) received the 2011 Allen B. DuMont Prize at RPI Commencement in May 2011. This prize was established by the Allen B. DuMont Foundation in memory of Dr. DuMont, and awarded at Commencement to a graduate student who has demonstrated high scholastic ability and has made a substantial contribution to his/her field.

Rensselaer Professor James Lu Named IEEE Fellow, 3D IC, 3D TSV

Prof. Lu was recently named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) "for contributions to three-dimensional integrated circuit technology". RPI Press Release, RPI Inside, 2/4/2011.
William D. Ashman Achievement Award of International Microelectronics and Packaging Society (IMAPS), 2010. RPI Press Release, 11/11/2010.
Dr. Qianwen Chen (陈倩文博士) (graduated spring 2011), received a 2011 Outstanding Young Scientist Award at Tsinghua University (清华大学微电子所2011年度学术新秀) and 2011 Oustanding Doctoral Graduate Award of Tsinghua University (清华大学2011年度优秀博士毕业生).
Zheng Xu, doctoral candidate, received the Best Paper Award in 43rd IMAPS International Symposium on Microelectronics, November 2010.
3D-IC Stacked Integrated Circuit Innovations Ready for Prime Time Manufacturing, Paul Werbaneth, SEMI News, May 3, 2011.
Adam Beece, doctoral student, received a highly competitive SRC/GRC Fellow supported by GlobalFoundries from August 2010 for upto 5 years (See SRC Fellowship and the news Inside Rensselaer).
IMAPS Member Spotlight: Spring 2010, http://www.imaps.org/membership/spotlight.htm
Slimmer Nanorods Lead to Low-Temperature Bonding, nanotechweb.org, Feb. 19, 2009
Slimmer, Stickier Nanorods Give Boost to 3-D Computer Chips, ScienceDaily, March 24, 2009, RPI Press Release, March 17, 2009
2008 IEEE CPMT Exceptional Technical Achievement Award, RPI Press Release, May 29, 2008 (Also see the news in Semiconductor International, Nanotechnology Now, Inside Rensselaer, and others)
The Original Nano Workout: Helping Carbon Nanotubes Get Into Shape , RPI Press Release, June 06, 2007
EE Times Top Story "Bunched nanotubes show promise for conducting electricity", Nicolas Mokhoff (06/07/2007 9:42 AM EDT)
Business Week Annual Report: "The Future of Technology and the IT 100: More Life For Moore's Law”, Printer-friendly PDF version, Business Week, Issue June 20, 2005
“Designing for New Dimensions: Rensselaer researchers reach for new heights with 3-D chip technology”, Printer-friendly PDF version, Rensselaer Research Quarterly, Spring 2005
Future ICs Go Vertical, in Semiconductor International, Feb. 14, 2005
Rensselaer Researchers Funded for 3-D Computer Chip Development, RPI Press Release, Dec. 06, 2004
The Lowdown on High-Rise Chips, by George Lawton, a 3D story at IEEE Computer Magazine, October Issue, 2004. (PDF version)
"Up, Not Sideways", PC Magazine, October 28, 2003.
When the 3-D Chips are Down, the Alchemist News at The Alchemist The ChemWeb Magazine, 8 September 2003 more > or here >

Making 3-D Chips a Reality, Press Release at RPI homepage, August 29, 2003.
Semiconductor International, 3-D ICs: How They Stack Up at RPI, Tech News of Emerging Technologies in Vol. 25, No. 8, p. 44, July 2003. [3D芯片：RPI的研究人员是如何将芯片堆叠起来的]
TV & Radio News: TV-clip from WRGB (Channel 6), TV News; and click here for more
Previous: click here

TV News of RPI 3D Research: RPI_3D_Research_TV_News_2003.wmv, WRGB CBS 6 Albany: Sept. 10, 2003, and Aug. 29, 2003, http://www.wrgb.com/

Research Areas:

General Research Interests:

Information technology: micro- nano-electronics for future chips using 3D TSV hyper-integration
Heterogeneous system integration technology: mixed signal systems for defense, security, energy, environment and medical devices
Nanotechnology: nano materials, structures, devices and applications
Biotechnology: bio-micro-systems for bio and medical devices
Energy and Solid-Stat Lighting technology: LED smart lighting, solar cell and fuel cell technology

Lu’s research interests are in the field of micro-nano-electronics technology from theory and design to materials, devices, processing, and system integration; particularly in wafer-level 3D hyper-integration technology and micro-nano-bio interfaces for future chips, novel electron devices, interconnect technology, micro-system integration technology for micro-electrical-mechanical systems (MEMS); with long-term research interests in photonics, nanotech, bio-MEMS, bio-engineering, bio-inspired materials/devices and information processing/computation, and combination (3D integration) of nano/bio with CMOS based technologies.

Wafer bonding for 3D Hyper-Integration: Cu/oxide interconnect structures after bonding to a glass wafer and Si substrate removal by grinding, polishing and TMAH etching. (Click picture to see detail) (The hand in the photo taken by Dr. Russ Kraft is Professor Lu’s).

Dr. Lu's research programs have been supported by National Science Foundation (NSF), Microelectronics Advanced Research Corporation (MARCO), the Defense Advanced Research Projects Agency (DARPA), Department of Energy (DoE), Domestic Nuclear Detection Office (DNDO) of U.S. Department of Homeland Security, New York State (NYSTAR), Semiconductor Research Corporation (SRC)/Glabol Research Corporation (GRC) and industries, and in collaborations with university colleagues, R&D institutions and industry partners. He and his colleagues have developed a 3D integration technology platform for future ICs with high performance and functionality and low cost, and for low-cost Micro/Nano/Electro-Opto/Bio heterogeneous system integrations. He has worked in a broad range of fields, such as GaAs devices, GaN high power devices, Si bipolar device, terahertz electronics, interconnects in Si IC, advanced packaging, and high Tc superconductors.

Click here to enlarge the image

A Vision of Future

3D Hyper-Integration

InfoTech, NanoTech and BioTech

systems,

by
vertically stacking

and

interconnecting

heterogeneous

materials, technologies & functions,

to enable

extremely high functionality

-
A New Paradigm

for Future Technologies

SEM Image of Densified Carbon-Nanotube (CNT) Bundle Array

for Applications, such as Interconnects (Taken by Michael Liu)

Conferences involved:

IEEE International Electron Devices Meeting (IEDM): http://www.his.com/~iedm/
IEEE International Conference on 3D System Integration (3D IC): http://www.3dic-conf.org/
IEEE International Interconnect Technology Conference (IITC): http://www.his.com/~iitc/
IEEE/ECA Electronic Components and Technology Conference (ECTC): http://www.ectc.net/
IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC): http://semi.omnibooksonline.com/main.html; http://www.semi.org/EventsTradeshows/CTR_040396
IMAPS International Symposium on Microelectronics: http://www.imaps.org/imaps2010/index.htm
IMAPS 3D Packaging Workshop at International Conference and Exhibition on Device Packaging: http://www.imaps.org/devicepackaging/
IMIC: International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection (CMP-MIC)
IMIC: International VLSI/ULSI Multilevel Interconnection (VMIC) Conferences (VMIC)
TMS: Electronic Materials Conference (EMC): http://www.tms.org/Meetings/Specialty/EMC10/home.aspx

Courses:

ECSE-6300: Integrated Circuit Fabrication Laboratory (IC Fab Lab); Course Website: http://www.ecse.rpi.edu/courses/S10/ecse6300/index.html

ECSE-2100: Fields and Waves; Course Website: http://www.rpi.edu/~luj/ECSE-2100/ (2011 Course Website)

ENGR-2050: Introduction to Engineering Design: http://rpilms.rpi.edu/webct/entryPageIns.dowebct

Selected Publications:

Forthcoming Book: Peter Ramm, James J.-Q. Lu, and Maaike M.V. Taklo, Handbook of Wafer Bonding, http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012 (in press). ISBN-13: 978-3527326464.

Recent chapters in the following books:

"Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits,” Volume 1 and 2, Eds. P. Garrou, C. Bower, and P. Ramm, pp. 249-259, pp. 447-462, Wiley-VCN, 2008, ISBN: 978-3-527-32034-9.

“Wafer Level 3-D ICs Process Technology,” Eds. C. S. Tan, R. Gutmann, and R. Reif, Springer, 2008, ISBN: 978-0-387-76532-7.

“Circuits at Nanoscale: Communications, Imaging and Sensing”, Ed: K. Iniewski, pp. 39-52, CRC Press, 2008, ISBN-13: 978-1420070620.

“Microelectronic Applications of Chemical Mechanical Planarization”, Eds. Y. Li, pp. 431-465, John Wiley & Sons, Inc., 2007, ISBN: 978-0-471-71919-9.

“Materials for Information Technology: Devices, Interconnects and Packaging”, Eds. E. Zschech, C. Whelan, T. Mikolajick, pp. 386 – 397, Springer-Verlag (London) Ltd, August 2005. ISBN: 1-85233-941-1.

J.-Q. Lu, “3D Hyper-Integration and Packaging Technologies for Micro-Nano-Systems,” (Invited) Proceedings of The IEEE, “Special Issue: 3D Integration Technology”, 97 (1), pp. 18-30, January 2009. (Abstract, PDF file)
J.-Q. Lu, K. Rose, and S. Vitkavage, “3D Integration: Why, What, Who, When?”, Future Fab International, Vol. 23, July 2007. (PDF file, or http://www.future-fab.com/documents.asp?d_ID=4396#)
F. Niklaus, G. Stemme, J.-Q. Lu, and R. Gutmann, “Adhesive Wafer Bonding”, Applied Physics Review – Focused Review, Journal of Applied Physics, Vol. 99, 031101 (2006), Issue 3, pp. 031101-1-28, Feb. 1, 2006. (Abstract, PDF file)
J.-Q. Lu, J.J. McMahon, and R.J. Gutmann, “3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer-Level Bonding Interfaces”, (Invited) in Materials and Technologies for 3-D Integration, Eds., F. Rooseboom, et al., pp.69-80, MRS Vol. 1112, Boston, Dec. 1 - 5, 2008. (Abstract, PDF file)
J.-Q. Lu, J.J. McMahon and R.J. Gutmann, “Via-First Inter-Wafer Vertical Interconnects utilizing Wafer-Bonding of Damascene-Patterned Metal/Adhesive Redistribution Layers,” Proc. of 3D Packaging Workshop at IMAPS Device Packaging Conference, paper # WP64, Scottsdale, AZ, March 20-23, 2006. (PDF file)
S.H. Lee, K.-N. Chen, and J.-Q. Lu, “Wafer-to-Wafer Alignment for 3D Integration”, IEEE/ASME Journal of Microelectromechanical Systems, 20 (4), pp. 885-898, Aug. 2011. (Abstract, PDF file)
Z. Xu and J.-Q. Lu, “High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 1 (2), pp. 154-162, February 2011. (Abstract, PDF file)
Z. Liu, L. Ci, S. Kar, P.M. Ajayan, and J.-Q. Lu, “Fabrication and Electrical Characterization of Densified Carbon Nanotube Micro-Pillars for IC Interconnection”, IEEE Transactions on Nanotechnology, 8 (2), pp. 196-203, March 2009. (Abstract, PDF file)
James Jian-Qiang Lu and Ronald Gutmann, Thorsten Matthias and Paul Lindner, "Aligned Wafer Bonding for 3-D Interconnect", Semiconductor International, 8/1/2005. (http://www.reed-electronics.com/semiconductor/article/CA630263?industryid=3032&nid=2012)
J.-Q. Lu, A. Jindal, Y. Kwon, J.J. McMahon, M. Rasco, R. Augur, T.S. Cale, and R.J. Gutmann, “Evaluation Procedures for Wafer Bonding and Thinning of Interconnect Test Structures for 3D ICs,” in 2003 IEEE International Interconnect Technology Conference (IITC), pp. 74-76, San Francisco, (June 2003). (PDF file)
T. Huang, J.-Q. Lu, D. Popa, B.H. Kang, “BCB Wafer Bonding Compatible with Bulk Micro Machining,” in International Electronic Packaging Technical Conference (InterPack2003), Hawaii, (July 2003).
J.-Q. Lu, A. Jindal, Y. Kwon, J.J. McMahon, K.-W. Lee, R.P. Kraft, B. Altemus, D. Cheng, E. Eisenbraun, T.S. Cale, and R.J. Gutmann, “3D System-on-a-Chip using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects,” in International Symposium on Thin Film Materials, Processes, and Reliability at the 203rd Meeting of The Electrochemical Society, Inc., Paris, (2003).
J.-Q. Lu, K.W. Lee, Y. Kwon, G. Rajagopalan, J.J. McMahon, B. Altemus, M. Gupta, E. Eisenbraun, B. Xu, A. Jindal, R.P. Kraft, J.F. McDonald, J. Castracane, T.S. Cale, A. Kaloyeros, and R.J. Gutmann, "Processing of Inter-Wafer Vertical Interconnects in 3D ICs," in Advanced Metallization Conference 2002 (AMC 2002), MRS Proc V18, pp. 45-51, Eds. B.M. Melnick, et al. (2002).
J.-Q. Lu, A. Kumar, Y. Kwon, E.T. Eisenbraun, R.P. Kraft, J.F. McDonald, R.J. Gutmann, T.S. Cale. P. Belemjain, O. Erdogan, J. Castracane, and A.E. Kaloyeros, “3-D Integration Using Wafer Bonding,” in Advanced Metallization Conference 2000 (AMC 2000), MRS Proc. V16, pp. 515-521, Eds. D. Edelstein, et al. (2000). (PDF file)
J.-Q. Lü, M.S. Shur, J.L. Hesler, L. Sun, and R. Weikle, "Terahertz Detector Utilizing Two-Dimensional Electronic Fluid," IEEE Electron Device Letters, 19 (10), pp. 373-375, (1998). (PDF file)
J.-Q. Lü, M.S. Shur, J.L. Hesler, L. Sun, and R. Weikle, "A Resonant Terahertz Detector Utilizing a High Electron Mobility Transistor,” Digest of 1998 IEEE International Electron Devices Meeting (IEDM'98), 453-456, (December 1998).
J.-Q. Lü, M.J. Hurt, W.C.B. Peatman, and M.S. Shur, "Heterodimensional Field Effect Transistors For Ultra Low Power Applications," in Proceedings of 1998 IEEE GaAs IC Symposium, Atlanta, GA, pp. 187-190, (November 1998). (PDF file)
J.-Q. Lü and F. Koch "Random Telegraph Noise in Advanced Self-Aligned Bipolar Transistors," in Japanese Journal of Applied Physics, 35 (1), 2B, pp. 826-832, (1996).