James Jian-Qiang Lü

Professor, IEEE Fellow

Department of Electrical, Computer, and Systems Engineering (ECSE);

NSF Smart Lighting Engineering Research Center (ERC);

Center for Integrated Electronics (CIE);

Focus Center - New York, Rensselaer: Interconnections for Hyper-Integration (FC-NY);
Center for Future Energy Systems (CFES);
New York State Center for Automation Technologies and Systems (CATS)

Rensselaer Polytechnic Institute (RPI) 


 

James Lu, IEEE Fellow. 3D IC, 3D TSV Integration and Packaging

 

 James J.-Q. Lu

 Professor 

 Depts.: ECSE, CIE, FC-NY, CFES, CATS, Smart Lighting ERC

 

 Ph.D. (Dr.rer.nat.): Technical University of Munich, Germany, December 1995

 

 Fellow: Institute of Electrical and Electronics Engineer (IEEE

 Fellow and Life Member: International Microelectronics and Packaging Society (IMAPS)


William D. Ashman Achievement Award, James Lu, 3D IC

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Career Highlights:

 

Dr. James Lu is currently a professor in ECSE.  He is a faculty member of the NSF Smart Lighting Engineering Research Center (ERC);  Center for Integrated Electronics (CIE); Focus Center – New York (FC-NY), Rensselaer: Interconnections for Hyper-Integration; the New York State Center for Automation Technologies and Systems (CATS); and Center for Future Energy Systems (CFES). Prior to his positions at Rensselaer, Lu worked as a research associate at the University of Virginia (UVA) in Charlottesville, VA. for a year. While a research scientist at the Technical University of Munich (TU-Munich), he was a Siemens Scholar for three years and a scholar of the German Academic Exchange Program (Deutscher Akademischer Austausch Dienst, or DAAD) for two years.  He received his Dr.rer.nat. degree from Technical University of Munich in 1995, M.S. degree from Peking Normal University in 1986, and B.S. degree from Shanxi Normal University in 1983.     

 

Dr. Lu authored and co-authored >250 publications in journals, conferences or books. He served as conference, workshop and session chair and committee members of international conferences (such as General Chair of IMAPS  International Conference on Device Packaging). He has been a panelist, panel moderator, keynote or invited speaker for many conferences, and given many seminars at government labs, universities and industrial organizations. He has served as a reviewer for a number of journals, such as the Institute of Electrical and Electronics Engineers (IEEE) Transactions on Electron Devices; IEEE Electron Device Letters;  Applied Physics Letters; Electronics Letters; IEEE Transactions on Semiconductor Manufacturing; IEEE Journal of Solid-State Circuits; Journal of Applied Physics; Solid-State Electronics, J. of Vacuum Science & Technology, etc. He is listed in the special Millennium Edition of Marquis Who's Who in Science and Engineering, received many honorable awards, including the “School of Engineering Research Excellence Award”, Rensselaer, Troy, NY, 2005, the 2008 IEEE CPMT Exceptional Technical Achievement Award "for his pioneering contributions to and leadership in 3D integration/packaging”,  the IMAPS 2010 William D. Ashman Achievement Award "for contributions and research in 3D integration and packaging; for leadership contributions at international symposiums and device packaging conferences, and 3-D packaging workshops," and   School of Engineering Faculty Award: Outstanding Research Team”, Rensselaer, Troy, NY, 2011.

 

Dr. Lu is a Fellow of IEEE and is involved in the organization’s Electron Devices Society (EDS) and its Components, Packaging, and Manufacturing Technology Society (CPMTS), and a Fellow and Life member of International Microelectronics and Packaging Society (IMAPS).  He also is a member of the American Physical Society (APS), Materials Research Society (MRS), Electrochemical Society (ECS) and the International Society of Electrochemistry (ISE), National Technical Committee (3D Chair) for International Microelectronics and Packaging Society (IMAPS).


 

Research Group News :

Rensselaer Professor James Lu Named IEEE Fellow, 3D IC, 3D TSV


TV News of  RPI 3D Research: RPI_3D_Research_TV_News_2003.wmv,  WRGB CBS 6 Albany: Sept. 10, 2003, and Aug. 29, 2003, http://www.wrgb.com/



Research Areas:

 

General Research Interests:

 

Lu’s research interests are in the field of micro-nano-electronics technology from theory and design to materials, devices, processing, and system integration; particularly in wafer-level 3D hyper-integration technology and micro-nano-bio interfaces for future chips, novel electron devices, interconnect technology, micro-system integration technology for micro-electrical-mechanical systems (MEMS); with long-term research interests in photonics, nanotech, bio-MEMS, bio-engineering, bio-inspired materials/devices and information processing/computation, and combination (3D integration) of nano/bio with CMOS based technologies.       

 

Text Box: Wafer bonding for 3D Integration: Cu/oxide interconnect structures after bonding to a glass wafer and Si substrate removal by grinding, polishing and TMAH etching. (Click picture to see detail) (The hand in the photo is Professor James Lu’s)
Wafer bonding for 3D Hyper-Integration: Cu/oxide interconnect structures after bonding to a glass wafer and Si substrate removal by grinding, polishing and TMAH etching. (Click picture to see detail) (The hand in the photo taken by Dr. Russ Kraft is Professor Lu’s).  

 

Dr. Lu's research programs have been supported by National Science Foundation (NSF), Microelectronics Advanced Research Corporation (MARCO), the Defense Advanced Research Projects Agency (DARPA), Department of Energy (DoE), Domestic Nuclear Detection Office (DNDO) of U.S. Department of Homeland Security, New York State (NYSTAR), Semiconductor Research Corporation (SRC)/Glabol Research Corporation (GRC) and industries, and in collaborations with university colleagues, R&D institutions and industry partners.  He and his colleagues have developed a 3D integration technology platform for future ICs with high performance and functionality and low cost, and for low-cost Micro/Nano/Electro-Opto/Bio heterogeneous system integrations. He has worked in a broad range of fields, such as GaAs devices, GaN high power devices, Si bipolar device, terahertz electronics, interconnects in Si IC, advanced packaging, and high Tc superconductors. 

  

   
3D Integration, TSV

A Vision of Future

3D Hyper-Integration

of

InfoTech, NanoTech and BioTech

systems,

by
vertically stacking

and

interconnecting

heterogeneous

materials, technologies & functions, 

to enable

extremely high functionality

-
A New Paradigm

for Future Technologies

 

SEM Image of Densified Carbon-Nanotube (CNT) Bundle Array 

for Applications, such as Interconnects (Taken by Michael Liu)

   



 

Conferences involved:


  
 

Courses:

 

Selected Publications:

 

Peter Ramm, James J.-Q. Lu, and Maaike M.V. Taklo, Handbook of Wafer Bonding,  http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012. ISBN: 978-3-527-32646-4.


Recent chapters in the following books:


"Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits,” Volume 1 and 2,  Eds. P. Garrou, C. Bower, and P. Ramm, pp. 249-259, pp. 447-462, Wiley-VCN, 2008, ISBN: 978-3-527-32034-9.


Wafer Level 3-D ICs Process Technology,” Eds. C. S. Tan, R. Gutmann, and R. Reif, Springer, 2008,  ISBN: 978-0-387-76532-7. 


Circuits at Nanoscale: Communications, Imaging and Sensing”, Ed: K. Iniewski, pp. 39-52, CRC Press,  2008, ISBN-13: 978-1420070620.


Microelectronic Applications of Chemical Mechanical Planarization”, Eds. Y. Li, pp. 431-465, John Wiley & Sons, Inc., 2007, ISBN: 978-0-471-71919-9. 


Materials for Information Technology: Devices, Interconnects and Packaging”, Eds. E. Zschech, C. Whelan, T. Mikolajick, pp. 386 – 397, Springer-Verlag (London) Ltd, August 2005. ISBN: 1-85233-941-1.


 


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Contact Information: 

James Lu

Office: CII-6229

MailStop: CII-6015 / CIE
Rensselaer Polytechnic Institute
110 8th Street, Troy, NY 12180-3590
Tel: (518) 276-2909


 

www.rpi.edu/~luj   

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